论文信息 - A Multiscale Modeling Approach for Microelectronic Packaging Applications

A Multiscale Modeling Approach for Microelectronic Packaging Applications

ABSTSRACT With the increasing complexity of microelectronic systems and ongoing miniaturization, reliability issues and their associated structural dimensions cross over from the microto the nanoscale. From this perspective fracture of materials and material interfaces for microelectronic components is essentially a multi-scale process. A Consortium of companies and research institutions is putting this multiscale perspective into practice as part of the NanoInterface project (http://www.nanointerface.eu/). In this paper the individual simulation methods (atomistic, mesoscale and microscale) will be discussed and first results on the multilevel aspects will be presented.

Bernhard Wunderle | Nancy Iwamoto | S Todd | O Hölck | S Noijen

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