Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film
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Yu-Min Lin | J. Lau | C. Zhan | Yu-wei Huang | S. Lu | J. Juang | Su-Mei Chen | Chia-Wen Fan | Yu-lan Lu | Su-Ching Chung | Jon-Shiou Peng | Pai-Cheng Chang | Shin-Yi Huang