Grain boundary electromigration and creep

[1]  Tu Electromigration in stressed thin films. , 1992, Physical review. B, Condensed matter.

[2]  A. Powell,et al.  The determination of strain in Si-Ge superlattices by electron diffraction in a scanning transmission electron microscope , 1991 .

[3]  P. Ho,et al.  Electromigration in metals , 1989 .

[4]  Che-yu Li,et al.  Analysis of thermal stress‐induced grain boundary cavitation and notching in narrow Al‐Si metallizations , 1988 .

[5]  Kenji Hinode,et al.  Stress‐induced grain boundary fractures in Al–Si interconnects , 1987 .

[6]  Donald S. Gardner,et al.  Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques , 1986 .

[7]  Conyers Herring,et al.  Stress generation by electromigration , 1976 .

[8]  R. Rosenberg,et al.  Electromigration Damage in Aluminum Film Conductors , 1970 .

[9]  R. Rosenberg VALUE D0Z* FOR GRAIN BOUNDARY ELECTROMIGRATION IN ALUMINUM FILMS , 1970 .

[10]  Paul Shewmon,et al.  Diffusion in Solids , 2016 .

[11]  P. Mazur,et al.  Non-equilibrium thermodynamics, , 1963 .

[12]  H. B. Huntington,et al.  Current-induced marker motion in gold wires☆ , 1961 .

[13]  R. L. Coble,et al.  Sintering Crystalline Solids. I. Intermediate and Final State Diffusion Models , 1961 .

[14]  W. Luder Introduction to thermodynamics of irreversible processes , 1955 .

[15]  R. Whipple CXXXVIII. Concentration contours in grain boundary diffusion , 1954 .

[16]  J. C. Fisher Calculation of Diffusion Penetration Curves for Surface and Grain Boundary Diffusion , 1951 .