Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary layer on substrate surfaces and hence improve the cooling ability of a module without any additional active parts. Furthermore, the concept of openings has not only so far provided at least 12% improvement in heat transfer, but also reduced some difficulties in finding thermal solution, such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect.

[1]  S. R. Mathur,et al.  Finite Volume Method for Radiative Heat Transfer Using Unstructured Meshes , 1998 .

[2]  T. Hung,et al.  Effects of Thermal Radiation for Electronic Cooling on Modified PCB Geometry under Natural Convection , 2007 .

[3]  T. Hung,et al.  Conjugate Heat Transfer Analysis for the Passive Enhancement of Electronic Cooling Through Geometric Modification in a Mixed Convection Domain , 1999 .

[4]  D. Mallik,et al.  Thermal characteristics of single and multi-layer high performance PQFP packages , 1990 .

[5]  L. T. Yeh,et al.  Review of Heat Transfer Technologies in Electronic Equipment , 1995 .

[6]  G. Raithby,et al.  COMPUTATION OF RADIANT HEAT TRANSFER ON A NONORTHOGONAL MESH USING THE FINITE-VOLUME METHOD , 1993 .

[7]  B. Chambers,et al.  Thermal performance limits of the QFP family , 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[8]  Frank P. Incropera,et al.  Fundamentals of Heat and Mass Transfer , 1981 .

[9]  J. P. V. Doormaal,et al.  ENHANCEMENTS OF THE SIMPLE METHOD FOR PREDICTING INCOMPRESSIBLE FLUID FLOWS , 1984 .

[10]  Prediction of radiative transfer in general body-fitted coordinates , 1997 .

[11]  E. Sparrow,et al.  Enhanced and local heat transfer, pressure drop, and flow visualization for arrays of block-like electronic components , 1983 .

[12]  R. J. Goldstein,et al.  Natural convection mass transfer adjacent to horizontal plates , 1973 .

[13]  Darvin R. Edwards,et al.  Thermal enhancement of plastic IC packages , 1995 .

[14]  Ephraim M Sparrow,et al.  Convective heat transfer response to height differences in an array of block-like electronic components , 1984 .

[15]  J. Lloyd,et al.  Natural Convection Adjacent to Horizontal Surface of Various Planforms , 1974 .

[16]  Suhas V. Patankar,et al.  Finite volume radiative heat transfer procedure for irregular geometries , 1994 .

[17]  F. P. Tsai,et al.  Simulations of passively enhanced conjugate heat transfer across an array of volumetric heat sources , 1997 .

[18]  G. P. Peterson,et al.  Thermal Control of Electronic Equipment and Devices , 1990 .

[19]  G. D. Raithby,et al.  A Finite-Volume Method for Predicting a Radiant Heat Transfer in Enclosures With Participating Media , 1990 .

[20]  T. Hung.  A CONCEPTUAL DESIGN OF THERMAL MODELING FOR EFFICIENTLY COOLING AN ARRAY OF HEATED , 2001 .

[21]  NUMERICAL ANALYSIS OF CONDUCTION. CONVECTION, AND RADIATION IN A GRADUALLY EXPANDING CHANNEL , 1996 .

[22]  Seung Wook Baek,et al.  Nonorthogonal finite-volume solutions of radiative heat transfer in a three-dimensional enclosure , 1998 .