Design and consideration of wafer level micropackaging for distributed RF MEMS phase shifters
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Ming-xin Song | Qun Wu | Jing-hua Yin | Xunjun He | Kai Tang | Boshi Jin | Hui-cheng Zhu
[1] L.P.B. Katehi,et al. High frequency parasitic effects for on-wafer packaging of RF MEMS switches , 2003, IEEE MTT-S International Microwave Symposium Digest, 2003.
[2] Jung-Mu Kim,et al. Packaging method for RF MEMS devices using LTCC capping substrate and BCB adhesive bonding , 2005, The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05..
[3] Jian Cai,et al. Microstructure of AuSn Wafer Bonding for RF-MEMS Packaging , 2005, 2005 6th International Conference on Electronic Packaging Technology.
[4] Gabriel M. Rebeiz,et al. Optimization of distributed MEMS phase shifters , 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).
[5] Gabriel M. Rebeiz,et al. RF MEMS switches and switch circuits , 2001 .
[6] Farrokh Ayazi,et al. Wafer-level MEMS packaging via thermally released metal-organic membranes , 2006 .
[7] David I. Forehand,et al. Wafer Level Micropackaging for RF MEMS Switches , 2005 .
[8] Gabriel M. Rebeiz,et al. High-isolation CPW MEMS shunt switches. 1. Modeling , 2000 .
[9] Morton,et al. Wide-band finite ground coplanar (FGC) interconnects for on-chip packaging of RF MEMS switches used in smart antennas and phased arrays , 2004, IEEE Antennas and Wireless Propagation Letters.