Electrical design of a cost-effective thermal enhanced plastic ball grid array package-NuBGA

An electrically and thermally optimized plastic ball grid array (PBGA) package, called new and useful ball grid array (NuBGA) is presented. NuBGA is a cavity down package with a metal heat spreader covering the entire back-side of the chip. The heat spreader is laminated with a single-core double-sided organic substrate. Super electrical performance is achieved by using the split-wrap-around (SWA) or split-via-connection (SVC) design concepts. All traces on the core substrate are designed into /spl mu/-stripline and co-planar stripline structures. In this paper, the focus is on (1) the unique design concepts; (2) the electrical measurement; (3) the electrical analysis; (4) the electrical performance comparison with other standard packages.