Future trends and applications of ultra-clean technology
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It is demonstrated that ultraclean technology is a crucial factor in developing high-quality processing technology for future ULSI fabrication. The simultaneous realization of three conditions, i.e. an ultraclean processing environment, an ultraclean wafer surface, and perfect process-parameter control, is what makes it possible to realize high-quality processing. A novel process flow for advanced CMOS device fabrication has been established by introducing total low-temperature processing as well as metal fluoridation technology, both of which have been realized for the first time by ultraclean technology.<<ETX>>
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