Modeling of multi-vias coupling for high speed interconnects

Modeling of multiple via coupling is an important problem in the design of high-speed interconnect systems. It is known that the inter-via coupling has non-negligible effects on the signal integrity of high-speed circuits. In this paper, we investigate first order multi-via coupling based on a two-coupled-vias model. Analytical results are compared with experimental data up to 5GHz. Transient waveforms were obtained for reflection and transmission for trapezoidal and Gaussian input.