SOLUTIONS FOR DICING RELEASED CMOS -MEMS MULTI-PROJECT WAFER

This paper presents two simple but practical methods to dice the CMOS (Complementary metal oxide semiconductor)-MEMS (Micro electromechanical system) Multi-Project Wafer. On this wafer, micromachined microstructures have been fabricated and released. Conventional diamond blade dicing is usually harmful, and easily damages the microstructures. To avoid this problem, the thick photoresist protective coating and laser dicing methods are proposed. Also, to demonstrate the safety and reliability of our methods, a suspended MEMS inductor was fabricated, and its inductance and quality factor were measured. Because of their simplicity and high reliability, these two methods are expected to benefit the CMOS MEMS technologies. In addition, they may be useful in the packaging of system-on-chip.

[2]  C. Kim,et al.  Microrivets for MEMS packaging: concept, fabrication, and strength testing , 1997 .

[3]  Todd E. Lizotte.  Laser dicing of chip scale and silicon wafer scale packages , 2003, IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003..

[4]  K. Najafi,et al.  A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding , 2001 .

[5]  C.T.-C. Nguyen,et al.  Tunable, switchable, high-Q VHF microelectromechanical bandpass filters , 1999, 1999 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC. First Edition (Cat. No.99CH36278).

[6]  Gary K. Fedder,et al.  Micromachined high-Q inductors in a 0.18-/spl mu/m copper interconnect low-k dielectric CMOS process , 2002 .

[7]  Kun Wang,et al.  High-order medium frequency micromechanical electronic filters , 1999 .