论文信息 - Simulation and Optimization of Via in Multi-Layer PCB

Simulation and Optimization of Via in Multi-Layer PCB

The discontinuity of via is one of the key factors in multi-layer PCB design. As frequency increases, via can cause reflection that seriously affects system performance and the integrity of signal. In this paper, the full-wave HFSS simulation software is used for modeling and simulation of multi-layer PCB via. The size of via on signal integrity is analyzed and the influence of back-drilling to stub is researched. The simulation results can be practical guidance for multi-layer PCB design.

Jia Lu | Chunrong Zhang

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