Determination of interface fracture toughness of adhesive joint subjected to mixed-mode loading using finite element method

In this study, a compact mixed-mode (CMM) specimen, which comprises an adhesive joint and a loading fixture, is employed to determine interface fracture toughness of an adhesively sandwiched joint with an interface edge crack subjected to global mixed-mode loading. An interface mechanics-based finite element (FE) method is developed to simulate the stress and displacement distributions around the tip of an interface edge crack situated in the sandwiched joint. A small region crack-tip opening displacement (CTOD)-based linear extrapolation method is developed to determine stress intensity factors (SIFs) at the crack-tip. Effect of pre-crack length on the SIFs is studied and a length range of pre-crack is proposed for the determination of SIFs. Furthermore, these methodologies are applied to characterize the critical interface fracture toughness of the sandwiched joint. Three types of fracture criteria, i.e., modes I and II critical fracture toughness-based failure assessment diagram (FAD), effective critical fracture toughness-based failure assessment criterion (FAC), and strain energy release rate-based FAC, are established for the reliability design and failure assessment of the adhesively bonded sandwich joint.

[1]  Yuuki Ryoji,et al.  Mixed mode fracture criteria for an interface crack , 1994 .

[2]  Jianmin Qu,et al.  A Technique to Measure Interfacial Toughness Over a Range of Phase Angles , 2000 .

[3]  James R. Rice,et al.  Elastic Fracture Mechanics Concepts for Interfacial Cracks , 1988 .

[4]  Chun H. Wang.  Fracture of interface cracks under combined loading , 1997 .

[5]  J. Dundurs,et al.  Discussion of Edge-Bonded Dissimilar Orthogonal Elastic Wedges under Normal and Shear Loading , 1969 .

[6]  R. McMeeking,et al.  A method for calculating stress intensities in bimaterial fracture , 1989 .

[7]  Norman A. Fleck,et al.  Brittle fracture of adhesive joints , 1992 .

[8]  C. Shih,et al.  Elastic-Plastic Analysis of Cracks on Bimaterial Interfaces: Part I—Small Scale Yielding , 1988 .

[9]  J. H. Lau,et al.  Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills , 2000 .

[10]  Zhigang Suo,et al.  Sandwich test specimens for measuring interface crack toughness , 1989 .

[11]  J. Dundurs.  Discussion: ``Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading'' (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460-466) , 1969 .

[12]  Xunqing Shi,et al.  Interfacial fracture toughness test methodology for adhesive bonded joints , 2002 .

[13]  H. Pang,et al.  A Compact Mixed Mode (CMM) fracture specimen for adhesive bonded joints , 1997 .

[14]  Zhigang Suo,et al.  Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches , 1990 .

[15]  Z. Suo,et al.  Mixed mode cracking in layered materials , 1991 .

[16]  John H. L. Pang,et al.  Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system , 2004, Microelectron. Reliab..

[17]  Z. P. Wang,et al.  A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages , 2003, Microelectron. Reliab..

[18]  R. Narasimhan,et al.  Experimental and numerical investigations of mixed mode crack growth resistance of a ductile adhesive joint , 2002 .

[19]  David B. Bogy,et al.  Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading , 1968 .