Application of VSI‐EBG Structure to High‐Speed Differential Signals for Wideband Suppression of Common‐Mode Noise

In this paper, we present wideband common‐mode (CM) noise suppression using a vertical stepped impedance electromagnetic bandgap (VSI‐EBG) structure for high‐speed differential signals in multilayer printed circuit boards. This technique is an original design that enables us to apply the VSI‐EBG structure to differential signals without sacrificing the differential characteristics. In addition, the analytical dispersion equations for the bandgap prediction of the CM propagation in the VSI‐EBG structure are extracted, and the closed‐form expressions for the bandgap cutoff frequencies are derived. Based on the dispersion equations, the effects of the impedance ratio, the EBG patch length, and via inductances on the bandgap of the VSI‐EBG structure for differential signals are thoroughly examined. The proposed dispersion equations are verified through agreement with the full‐wave simulation results. It is experimentally demonstrated that the proposed VSI‐EBG structure for differential signaling suppresses the CM noise in the wideband frequency range without degrading the differential characteristics.

[1]  D. Sievenpiper,et al.  High-impedance electromagnetic surfaces with a forbidden frequency band , 1999 .

[2]  R. Abhari,et al.  Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[3]  L. L. Wai,et al.  Mixed-mode S-parameter characterization of differential structures , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[4]  Wei-Da Guo,et al.  Noise reduction using compensation capacitance for bend discontinuities of differential transmission lines , 2006, IEEE Transactions on Advanced Packaging.

[5]  Wei-Da Guo,et al.  A Systematic Design to Suppress Wideband Ground Bounce Noise in High-Speed Circuits by Electromagnetic-Bandgap-Enhanced Split Powers , 2006, IEEE Transactions on Microwave Theory and Techniques.

[6]  C. Sreerama Effects of skew on EMI for HDMI connectors and cables , 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

[7]  Joungho Kim,et al.  Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications , 2006, IEEE Microwave and Wireless Components Letters.

[8]  B. Archambeault,et al.  EMI Emissions from mismatches in High Speed Differential Signal Traces and Cables , 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

[9]  Tzong-Lin Wu,et al.  An Embedded Common-Mode Suppression Filter for GHz Differential Signals Using Periodic Defected Ground Plane , 2008, IEEE Microwave and Wireless Components Letters.

[10]  T. Itoh,et al.  A Novel Wideband Common-Mode Suppression Filter for Gigahertz Differential Signals Using Coupled Patterned Ground Structure , 2009, IEEE Transactions on Microwave Theory and Techniques.

[11]  Jinwoo Choi,et al.  Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN) , 2010, IEEE Transactions on Advanced Packaging.

[12]  Jun Fan,et al.  Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions , 2010, IEEE Transactions on Electromagnetic Compatibility.

[13]  Tzong-Lin Wu,et al.  A Broadband and Miniaturized Common-Mode Filter for Gigahertz Differential Signals Based on Negative-Permittivity Metamaterials , 2010, IEEE Transactions on Microwave Theory and Techniques.

[14]  F de Paulis,et al.  Design of a Common Mode Filter by Using Planar Electromagnetic Bandgap Structures , 2010, IEEE Transactions on Advanced Packaging.

[15]  Chulsoon Hwang,et al.  A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs , 2012, IEEE Transactions on Electromagnetic Compatibility.

[16]  Joungho Kim,et al.  Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression , 2012, IEEE Microwave and Wireless Components Letters.

[17]  B. Archambeault,et al.  Optimum geometrical parameters for the EBG-based common mode filter design , 2012, 2012 IEEE International Symposium on Electromagnetic Compatibility.

[18]  Seungyoung Ahn,et al.  Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs , 2013, IEEE Transactions on Electromagnetic Compatibility.