Crosstalk Induced Delay Analysis of Randomly Distributed Mixed CNT Bundle Interconnect
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Brajesh Kumar Kaushik | Manoj Kumar Majumder | Pankaj Kumar Das | Vobulapuram Ramesh Kumar | Vobulapuram Ramesh Kumar | B. Kaushik | M. Majumder | P. Das
[1] Madhu Menon,et al. Various bonding configurations of transition-metal atoms on carbon nanotubes: Their effect on contact resistance , 2000 .
[2] P. Avouris,et al. Engineering Carbon Nanotubes and Nanotube Circuits Using Electrical Breakdown , 2001, Science.
[3] P. Burke. Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes , 2002 .
[4] S. Louie,et al. Quantum conductance of multiwall carbon nanotubes , 2002 .
[5] P. Avouris,et al. Multishell conduction in multiwalled carbon nanotubes , 2002 .
[6] D. Glattli,et al. Determination of the intershell conductance in multiwalled carbon nanotubes. , 2004, Physical review letters.
[7] A. Kawabata,et al. Carbon nanotube vias for future LSI interconnects , 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).
[8] Y. Li,et al. Greedy algorithms for packing unequal circles into a rectangular container , 2005, J. Oper. Res. Soc..
[9] J. Meindl,et al. Compact physical models for multiwall carbon-nanotube interconnects , 2006, IEEE Electron Device Letters.
[10] A. Kawabata,et al. Novel approach to fabricating carbon nanotube via interconnects using size-controlled catalyst nanoparticles , 2006, 2006 International Interconnect Technology Conference.
[11] M. S. Sarto,et al. Electromagnetic Analysis of Radio-Frequency Signal Propagation Along SWCN Bundles , 2006, 2006 Sixth IEEE Conference on Nanotechnology.
[12] A. Kawabata,et al. Electrical Properties of Carbon Nanotube Via Interconnects Fabricated by Novel Damascene Process , 2007, 2007 IEEE International Interconnect Technology Conferencee.
[13] A. Maffucci,et al. A transmission line model for metallic carbon nanotube interconnects , 2008, Int. J. Circuit Theory Appl..
[14] J. Meindl,et al. Performance Modeling for Single- and Multiwall Carbon Nanotubes as Signal and Power Interconnects in Gigascale Systems , 2008, IEEE Transactions on Electron Devices.
[15] Q.H. Liu,et al. Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects , 2009, IEEE Transactions on Electron Devices.
[16] M. S. Sarto,et al. Fast Transient Analysis of Next-Generation Interconnects Based on Carbon Nanotubes , 2010, IEEE Transactions on Electromagnetic Compatibility.
[17] M. S. Sarto,et al. Single-Conductor Transmission-Line Model of Multiwall Carbon Nanotubes , 2010, IEEE Transactions on Nanotechnology.
[18] A. Srivastava,et al. A model for carbon nanotube interconnects , 2010 .
[19] D. Pavlidis,et al. Pronounced field emission from vertically aligned carbon nanotube blocks and bundles , 2011 .
[20] D. Das,et al. Analysis of Crosstalk in Single- and Multiwall Carbon Nanotube Interconnects and Its Impact on Gate Oxide Reliability , 2011, IEEE Transactions on Nanotechnology.
[21] Brajesh Kumar Kaushik,et al. Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects , 2012, 2012 Asia Pacific Conference on Postgraduate Research in Microelectronics and Electronics.
[22] S. K. Manhas,et al. Analysis of mixed CNT bundle interconnects: Impact on delay and power dissipation , 2012, 2012 5th International Conference on Computers and Devices for Communication (CODEC).
[23] S. K. Manhas,et al. Analysis of crosstalk delay and power dissipation in mixed CNT bundle interconnects , 2012, 2012 International Conference on Communications, Devices and Intelligent Systems (CODIS).
[24] N. D. Pandya,et al. Dynamic crosstalk effect in mixed cnt bundle interconnects , 2012 .
[25] S. Subash,et al. A New Spatially Rearranged Bundle of Mixed Carbon Nanotubes as VLSI Interconnection , 2013, IEEE Transactions on Nanotechnology.
[26] Brajesh Kumar Kaushik,et al. An Accurate FDTD Model for Crosstalk Analysis of CMOS-Gate-Driven Coupled RLC Interconnects , 2014, IEEE Transactions on Electromagnetic Compatibility.
[27] Vobulapuram Ramesh Kumar,et al. Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges , 2014, IEEE Nanotechnology Magazine.
[28] Brajesh Kumar Kaushik,et al. Delay and crosstalk reliability issues in mixed MWCNT bundle interconnects , 2014, Microelectron. Reliab..
[29] Brajesh Kumar Kaushik,et al. Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects , 2014, IEEE Transactions on Electromagnetic Compatibility.
[30] Brajesh Kumar Kaushik,et al. Crosstalk noise modeling of multiwall carbon nanotube (MWCNT) interconnects using finite-difference time-domain (FDTD) technique , 2015, Microelectron. Reliab..