System interconnection of high-density multichip modules

Multi-chip modules (MOM) have recently received much attention because they facilitate high density and speed packaging of electronic systems. MOM''s tradeoffs are examined here for logic and memory subsystems using a newly developed package system simulation methodology. MOM''s are optimized for CMOS technologies using the simulated annealing algorithm. Parameters for optimum MOM designs are shown to separate clearly in the response space. Based on this guidelines for computer system integration with MOM''s are set up.© (1991) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.