Low contact-force fritting probe card using buckling microcantilevers
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[1] Tadatomo Suga,et al. Electroplating Ni micro-cantilevers for low contact-force IC probing , 2003 .
[2] M. Beiley,et al. A micromachined array probe card-characterization , 1995 .
[3] R. Holm. Electric contacts; theory and application , 1967 .
[4] Katsuya Okumura,et al. Low contact force probing on copper electrodes , 2002, Proceedings. International Test Conference.
[5] Yongxia Zhang,et al. A new MEMS wafer probe card , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.
[6] Toshiki Hirano,et al. Silicon microprobing array for testing and burn-in , 1994, Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).
[7] Herbert Reichl,et al. Characteristics of fritting contacts utilized for micromachined wafer probe cards , 2000 .
[8] R. Sawada,et al. Micro IC probe for LSI testing , 1999, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291).
[9] R. B. Marcus,et al. Thermally actuated microprobes for a new wafer probe card , 1999 .
[10] M. Beiley,et al. A micromachined array probe card-fabrication process , 1995 .