Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks

Microfluidic cooling is considered an effective cooling method suitable for 3-D ICs. However, TSVs are placed in pin fins and coolant flows in between pin fins, so inserting more pin fins to increase the vertical bandwidth reduces the cooling capacity. This paper codesigns 3-D CPU architectures and microfluidic heatsinks to simultaneously optimize the performance and cooling capacity of 3-D ICs with microfluidic pin-fin heatsinks. The article shows that the codesign approach achieves better performance and energy efficiency than optimizing only the cooling capacity or the vertical bandwidth.

[1]  Sudhakar Yalamanchili,et al.  Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs , 2013, 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).

[2]  Gabriel H. Loh,et al.  3D-Stacked Memory Architectures for Multi-core Processors , 2008, 2008 International Symposium on Computer Architecture.

[3]  Xiaoxia Wu,et al.  Electrical Characterization for Intertier Connections and Timing Analysis for 3-D ICs , 2012, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[4]  Ajay Joshi,et al.  Run-time energy management of manycore systems through reconfigurable interconnects , 2011, GLSVLSI '11.

[5]  Yogendra Joshi,et al.  Pressure drop and heat transfer characteristics of square pin fin enhanced microgaps in single phase microfluidic cooling , 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

[6]  Rolf Riesen,et al.  A framework for architecture-level power, area, and thermal simulation and its application to network-on-chip design exploration , 2011, PERV.

[7]  Robert K. Brayton,et al.  Planning for performance , 1998, Proceedings 1998 Design and Automation Conference. 35th DAC. (Cat. No.98CH36175).

[8]  Sung Kyu Lim,et al.  Through-silicon-via management during 3D physical design: When to add and how many? , 2010, 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD).

[9]  Jie Meng,et al.  Optimizing energy efficiency of 3-D multicore systems with stacked DRAM under power and thermal constraints , 2012, DAC Design Automation Conference 2012.

[10]  Ankur Srivastava,et al.  Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs , 2015 .

[11]  Ankur Srivastava,et al.  Unlocking the true potential of 3D CPUs with micro-fluidic cooling , 2014, 2014 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED).