论文信息 - The effect of Cl(I)− ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper - 字舞流文

The effect of Cl(I)− ions on kinetics and mechanism of anodic dissolution and cathodic deposition of copper

[1] G. T. Rogers,et al. Electrocatalysis of copper deposition from acid sulphate solutions by sulphite and selenite ions , 1976 .

[2] J. Bockris,et al. Mechanism of electrodeposition and dissolution processes of copper in aqueous solutions , 1962 .