We have developed a general method for rapidly bonding semiconductor laser arrays, optical traveling wave amplifier arrays, and other optoelectronic devices to silicon waferboards or submounts. Our method uses octagonal electrodeposited copper bosses to physically register with precision etched inverted pyramidal receptacles in the silicon. Flip-chip bonding of semiconductor laser diode arrays is significantly faster with this method than with a commercial precision flip chip bonder which images the die and the substrate simultaneously (i.e. with the "vision servo" method). The pre-bond die placement window we obtained is compatible with certain standard flip chip bonders. The post-bond positioning accuracy that we have demonstrated is essential for minimizing the worst-case temperature rise in high power semiconductor lasers and high gain traveling wave amplifiers (TWAs) operating at high levels of current injection.
[1]
K. Bean,et al.
Anisotropic etching of silicon
,
1978,
IEEE Transactions on Electron Devices.
[2]
H. Melchior,et al.
Low cost packaging of semiconductor laser arrays using passive self-aligned flip-chip technique on Si motherboard
,
1996,
1996 Proceedings 46th Electronic Components and Technology Conference.
[3]
Isao Yoneda,et al.
Use of AuSn solder bumps in three-dimensional passive aligned packaging of LD/PD arrays on Si optical benches
,
1996,
1996 Proceedings 46th Electronic Components and Technology Conference.
[4]
Kazuhiko Kurata,et al.
A surface mount type single-mode laser module using passive alignment
,
1995
.
[5]
M. Tabasky,et al.
Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard
,
1991
.