Effect of Asymmetric Layout of IGBT Modules on Reliability of Motor Drive Inverters

Power electronics inverters are one of the major failure sources in motor drive systems, and power devices are one of the main causes of the power electronics inverter failures. Typically, an insulated-gate bipolar transistor (IGBT) module has multiple power devices due to some technical and cost advantages. This kind of configurations could have an asymmetric internal layout, which may lead to different thermal loadings and thereby lifetime difference of the power devices. Therefore, both the power rating and the lifetime of inverters are limited by the most stressed device. However, generally common data are provided for all devices in the datasheet and this may cause improper design of the inverters in terms of the lifetime and the power rating. In this paper, an effect of an asymmetric layout of IGBT modules on the reliability of motor drive inverters is studied based on a three-phase motor drive application with a 600 V, 30 A, three-phase transfer molded IGBT module. The thermal impedances of six IGBTs are investigated and its effect on thermal loadings of power devices is studied under the given mission profile. Then, their lifetimes are estimated and compared. Finally, this effect is verified by the experiments.

[1]  Frede Blaabjerg,et al.  Advanced Accelerated Power Cycling Test for Reliability Investigation of Power Device Modules , 2016, IEEE Transactions on Power Electronics.

[2]  Frede Blaabjerg,et al.  Reliability Improvement of Power Converters by Means of Condition Monitoring of IGBT Modules , 2017, IEEE Transactions on Power Electronics.

[3]  Ke Ma,et al.  Validation of Lifetime Prediction of IGBT Modules Based on Linear Damage Accumulation by Means of Superimposed Power Cycling Tests , 2018, IEEE Transactions on Industrial Electronics.

[4]  Huai Wang,et al.  Mission Profile Based System-Level Reliability Analysis of DC/DC Converters for a Backup Power Application , 2018, IEEE Transactions on Power Electronics.

[5]  T.A. Lipo,et al.  Fault tolerant three-phase AC motor drive topologies: a comparison of features, cost, and limitations , 2003, IEEE Transactions on Power Electronics.

[6]  Math Bollen,et al.  Reliability assessment of motor drives , 2006 .

[7]  Andreas Volke,et al.  IGBT modules : technologies, driver and application , 2012 .

[8]  Dawei Xiang,et al.  An Industry-Based Survey of Reliability in Power Electronic Converters , 2011, IEEE Transactions on Industry Applications.

[9]  Ion Boldea,et al.  Electric generators and motors: An overview , 2017 .

[10]  Frede Blaabjerg,et al.  Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations , 2016, Microelectron. Reliab..

[11]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[12]  Frede Blaabjerg,et al.  A Multipulse Pattern Modulation Scheme for Harmonic Mitigation in Three-Phase Multimotor Drives , 2016, IEEE Journal of Emerging and Selected Topics in Power Electronics.

[13]  Dehong Xu,et al.  Survey on Fault-Tolerant Techniques for Power Electronic Converters , 2014, IEEE Transactions on Power Electronics.

[14]  Mike Rogers,et al.  A new multi-functional compact IPM for low power industrial application , 2017, 2017 IEEE Applied Power Electronics Conference and Exposition (APEC).

[15]  F. Blaabjerg,et al.  New Approaches to Reliability Assessment: Using physics-of-failure for prediction and design in power electronics systems , 2016, IEEE Power Electronics Magazine.

[16]  F. Blaabjerg,et al.  Frequency-Domain Thermal Modeling and Characterization of Power Semiconductor Devices , 2016, IEEE Transactions on Power Electronics.

[17]  Frede Blaabjerg,et al.  Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress , 2018, IEEE Transactions on Power Electronics.

[18]  Frede Blaabjerg,et al.  Reliability Improvement of a T-Type Three-Level Inverter With Fault-Tolerant Control Strategy , 2015, IEEE Transactions on Power Electronics.

[19]  Frede Blaabjerg,et al.  Junction temperature estimation method for a 600 V, 30A IGBT module during converter operation , 2015, Microelectron. Reliab..