Low-cost inverted line in silicon/glass technology for filter in the ka-band

This paper introduces a new low-cost technology for inverted lines on glass or on silicon. After a description of the simple technological process, the single and coupled lines characteristics are examined versus several geometrical parameters. Electromagnetic simulations and measurements are compared and a good agreement is obtained between them. The line attenuation is shown to be very low. Another advantage of this technology is the increase of the coupled lines spacing for some given odd and even characteristic impedances in comparison with classical technology, which helps the design of coupled line filters. Using the presented line characteristics, a coupled line bandpass filter has been designed, fabricated, and characterized in the Ka-band. According to simulations, measurement results show the good performances of the filter: the bandpass is of 28%, the measured insertion loss and return loss are, respectively, -2.2 and -24dB at the center frequency. The attained performances show that the proposed technology is a good candidate to be used in the fabrication of millimeter-wave integrated circuits.

[1]  Jr. R. Wyndrum Microwave filters, impedance-matching networks, and coupling structures , 1965 .

[2]  S. El-Ghazaly,et al.  Integration of air-gap transmission lines on doped silicon substrates using glass microbump bonding techniques , 1998 .

[3]  Alain Bosseboeuf,et al.  An electromechanical mixer using silicon micromechanical capacitors and radio-frequency functions , 2000 .

[4]  E. M. Jones,et al.  Microwave Filters, Impedance-Matching Networks, and Coupling Structures , 1980 .

[5]  J. P. Mondal,et al.  Propagation constant determination in microwave fixture de-embedding procedure , 1988 .

[6]  Jong-Heon Kim,et al.  A new three‐dimensional 30 GHz bandpass filter using the LIGA micromachined process , 2001 .

[7]  Hiroshi Ogura,et al.  Packaging using microelectromechanical technologies and planar components , 2001 .

[8]  George E. Ponchak,et al.  RF Transmission Lines on Silicon Substrates , 1999, 1999 29th European Microwave Conference.

[9]  B. E. Spielman,et al.  Dissipation Loss Effects in Isolated and Coupled Transmission Lines , 1977 .

[10]  O. Picon,et al.  Low-Loss Microstrip MEMS Technology for RF Passive Components , 2001, 2001 31st European Microwave Conference.

[11]  N. Jain,et al.  Dispersion characteristics of microstrip transmission line on glass microwave IC's , 1997, IEEE Microwave and Guided Wave Letters.

[12]  Gaelle Lissorgues,et al.  A wideband 3D‐transition between coplanar and inverted microstrip on silicon to characterize a line in MEMS technology , 2005 .

[13]  S. K. Koul,et al.  Lumped Capacitance, Open-Circuit End Effects, and Edge-Capacitance of Microstrip-Like Transmission Lines for Microwave and Millimeter-Wave Applications , 1984 .

[14]  Dong-Wook Kim,et al.  High-performance air-gap transmission lines and inductors for millimeter-wave applications , 2002 .