论文信息 - Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

Multiscale 3D thermal analysis of analog ICs: From full-chip to device level

We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new methods and tools that import GDSII layout of entire IC and generate 3D model. The tool provides a 3D temperature map that can show thermal gradients across a chip, as well as local temperature distribution (hot spots) down to single transistor level. This allows introducing temperature back into design process. Our method and tools are demonstrated on a couple of radio-frequency (RF) chips. The multiscale modeling has been verified with infrared temperature measurements.

M. Turowski | A. Raman | M. Casto | S. Dooley

[1] M. Turowski,et al. Fast, automated thermal simulation of three-dimensional integrated circuits , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[2] Marek Turowski,et al. Layout Based Full Chip Thermal Simulations of Stacked 3D Integrated Circuits , 2003 .

[3] Zhiqiang Tan,et al. CFD-Micromesh: a fast geometric modeling and mesh generation tool for 3D microsystem simulations , 2000, Design, Test, Integration, and Packaging of MEMS/MOEMS.

[4] Physics-based and compact models for self-heating in high-speed bipolar integrated circuits , 2002 .

[5] G. Freeman,et al. Structure optimization of trench-isolated SiGe HBTs for simultaneous improvements in thermal and electrical performances , 2005, IEEE Transactions on Electron Devices.