论文信息 - On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology - 字舞流文

On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology

M. Kunz | N. Tamura | Kwang-yoo Byun | A. Budiman | H. Son | Young‐Chang Joo | Y.-L. Shen | R. Caramto | T. Tian | R. Morusupalli | Hwisu Shin | L. Smith | Y. Shen | Rao R. Morusupalli