Compact Quantum-Optic Photon-Pair Engine 3D-Integrated on BiCMOS Electronics

A silicon photon-pair engine based on spontaneous four-wave mixing in a compact micro-ring is implemented on SOI and transferred to BiCMOS through wafer-level 3D-integration. A coincidence rate of 160/sec per 200-GHz DWDM slice is obtained at 20% SPAD efficiency.