Method for profiling electroplating of copper plate of crystallizer

The invention discloses a method for profiling electroplating of the copper plate of a crystallizer. The method comprises the following steps of: lifting the copper plate soaked in an electroplating solution by a servo control system; dividing the copper plate into n sections and implementing electroplating work; driving the copper plate to displace according to delta hn=fn*tn by the servo control system, setting an electroplating current according to In=LC*(LK-delta hn)*IS, and controlling an electroplating electric quantity according to Qt=Qt-1 +In; and during an electroplating process, in the case that the actual electroplating current is less than the set electroplating current, stopping lifting the copper plate by the servo control system until the actual electroplating current is equal to or greater than the set electroplating current. During electroplating for the first section of the copper plate, the control mode of driving the copper plate to displace by the servo control system is stepless constant-speed, and during electroplating for other sections of the copper plate, the control mode of driving the copper plate to displace by the servo control system is sectional stepless constant-speed; and when the moving speed of the copper plate is zero, this section of the copper plate moves to a stationary position, and then the electroplated layer plane of this section is obtained. With the adoption of the method, the profiling coating of the copper plate can be obtained, the electroplating efficiency for the copper plate can be increased, the electroplating material can be saved, and the electroplating energy consumption can be reduced, thus contributing to implementation of the subsequent procedures for the copper plate.