Effects of Fe(III) and Cu(I) on Electrodeposition and Microstructure Characterization for Acid Plating Bath
暂无分享,去创建一个
L. Tian | Wenyao Yang | Yonggang Xu | Jing Xiang | Qiang Yang | Chong Zeng | Haibo Ruan | Yingjie Wang
[1] Xiaomin Wang,et al. Diketopyrrolopyrrole-based supramolecular nano-leveler for the enhancement of conformal copper electrodeposition , 2021 .
[2] Youtong Fang,et al. Trace bis-(3-sulfopropyl)-disulfide enhanced electrodeposited copper foils , 2021 .
[3] Ying Tao,et al. Temperature-dependent inhibition of PEG in acid copper plating: Theoretical analysis and experiment evidence , 2020 .
[4] S. Arai,et al. Fabrication of high thermal conductivity copper/diamond composites by electrodeposition under potentiostatic conditions , 2020, Journal of Applied Electrochemistry.
[5] Quanyong Wang,et al. Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating , 2020, ACS omega.
[6] Zhen Li,et al. Effects of Accelerator Alkyl Chain Length on the Microvia Filling Performance in Copper Superconformal Electroplating , 2019, Journal of The Electrochemical Society.
[7] Jinzhong Wang,et al. Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates , 2019, Composites Part B: Engineering.
[8] K. Kondo,et al. Monitoring of SPS Concentration by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution , 2019, Journal of The Electrochemical Society.
[9] Chi-Chang Hu,et al. The Degradation Behavior of Brightener on Dimensionally Stable Anodes during the Copper Electrodeposition , 2019, Journal of The Electrochemical Society.
[10] M. Sung,et al. Observation of Bis-(3-sulfopropyl) Disulfide (SPS) Breakdown at the Cu Cathode and Insoluble Anode under Open-Circuit, Unpowered Closed-Circuit, and Electrolysis Conditions , 2019, Journal of The Electrochemical Society.
[11] T. Homma,et al. In Situ Measurement for Diffusion-Adsorption Process of Cl− and SPS in Through-Silicon Via Using SERS Effect Produced by Cu Nanodot Arrays , 2019, Journal of The Electrochemical Society.
[12] Wei‐dong He,et al. Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole , 2018, Electrochimica Acta.
[13] Chi-Chang Hu,et al. Reconsider the depolarization behavior of copper electrodeposition in the presence of 3-mercapto-1-propanesulfonate , 2018, Electrochemistry Communications.
[14] Gianaurelio Cuniberti,et al. DFT study of interaction of additives with Cu(111) surface relevant to Cu electrodeposition , 2018, Journal of Applied Electrochemistry.
[15] Wei‐dong He,et al. Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination , 2017 .
[16] I. O. Wallinder,et al. Synergistic effects of gelatin and convection on copper foil electrodeposition , 2016 .
[17] Zengling Wang,et al. 2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating , 2016 .
[18] Zengling Wang,et al. Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations , 2015 .
[19] O. Takai,et al. A Study on the Decomposition of SPS and Its Effects on Via Filling Performance , 2015 .
[20] O. Takai,et al. Influence of SPS Decomposition Product 1,3-Propane Disulfonic Acid on Electrolytic Copper Via Filling Performance , 2015 .
[21] Taro Hayashi,et al. Role of Cuprous Ion in Copper Electrodeposition Acceleration , 2015 .
[22] Zengling Wang,et al. Investigation of Nitrogen Heterocyclic Compounds as Levelers for Electroplating Cu Filling by Electrochemical Method and Quantum Chemical Calculation , 2015 .
[23] Peixia Yang,et al. Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison , 2013 .
[24] Nguyen Cao Truong Hai,et al. On the Acceleration of Cu Electrodeposition by TBPS (3,3-thiobis-1-propanesulfonic acid): A Combined Electrochemical, STM, NMR, ESI-MS and DFT Study , 2013 .
[25] Taro Hayashi,et al. Correlation between Filled Via and Produced Cuprous Ion Concentration by Reverse Current Waveform , 2013 .
[26] A. West,et al. The Effect of Fe(III)/Fe(II) Redox Couple on Nucleus Density during Cu Electrodeposition Process , 2013 .
[27] Soo‐Kil Kim,et al. Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling , 2013 .
[28] Nguyen Cao Truong Hai,et al. Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating , 2012 .
[29] S. Yau,et al. Adsorption and desorption of bis-(3-sulfopropyl) disulfide during Cu electrodeposition and stripping at Au electrodes. , 2012, Langmuir : the ACS journal of surfaces and colloids.
[30] Nguyen Cao Truong Hai,et al. Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating , 2012 .
[31] Andrea Kellenberger,et al. Inhibition effect of some aromatic amines on copper electrodeposition from acidic baths , 2012, Journal of Applied Electrochemistry.
[32] A. West,et al. Interaction between SPS and MPS in the Presence of Ferrous and Ferric Ions , 2011 .
[33] A. West,et al. Investigation of Copper Plating and Additive Interactions in the Presence of Fe3+/Fe2+ Redox Couple , 2011 .
[34] Marco Arnold,et al. Classification of suppressor additives based on synergistic and antagonistic ensemble effects , 2011 .
[35] Jun Ma,et al. Strong enhancement on fenton oxidation by addition of hydroxylamine to accelerate the ferric and ferrous iron cycles. , 2011, Environmental science & technology.
[36] Wei-Ping Dow,et al. Microvia filling by copper electroplating using diazine black as a leveler , 2009 .
[37] K. Kondo,et al. Correlation between Cu (I)-complexes and filling of via cross sections by copper electrodeposition , 2009 .
[38] M. Pritzker,et al. Inhibition of Copper Deposition by Polyethylene Glycol and Chloride I. Model Development and Parameter Estimation , 2009 .
[39] K. Kondo,et al. Analytical Study of the Characteristics of Cu ( I ) Species for the Via-Filling Electroplating Using a RRDE , 2007 .
[40] Panayotis C. Andricacos,et al. The chemistry of additives in damascene copper plating , 2005, IBM J. Res. Dev..
[41] J. Barthelmes. Acid Copper Plating with Insoluble Anodes—A Novel Technology in PCB Manufacturing , 2000 .