Ni migration in solid oxide cell electrodes: Review and revised hypothesis

Severe degradation of Ni‐YSZ (yttria stabilized zirconia) electrodes of solid oxide cells (SOCs) due to Ni migration is well known, but the literature contains apparent contradictions. The mechanisms are still under debate. Fine structured Ni‐YSZ composite electrodes often degrade at operation temperature (700–950°C), because Ni particles lose electrical contact with each other as larger Ni‐particles grow on the expense of smaller ones. Another type of Ni migration, which may be very damaging, is the relocation of Ni in the most active part of the Ni‐YSZ cermet electrode next to the dense YSZ electrolyte. Emphasis is put on the migration of Ni away from the YSZ electrolyte in solid oxide electrolysis cells (SOECs). This is seen as an important obstacle to the commercialization of SOC systems.