피로수명과 가공공차를 고려한 수직형 탐침의 형상 설계에 관한 연구

Probe card of the vertical probe design is one of the very important issue for meet the high density. Maintaining a stable electrical contact is required to secure the appropriate contact force for wafer inspection probe. The probe of the wafer bonding pad oxide destroyed by the electrical contact resistance of less than 1Ω is to meet the level. Another thing to consider is the fatigue life cycle of an important requirement Probe. Wafer Probe and contact the bonding pad to the internal stress by calculating the value of the life of the expected fatigue life cycle, the process of expression is necessary. Wafer inspection probe to forecast the lifetime of the probe stress-fatigue criterion using life prediction based on the shape of the probe. To meet these performance for Wafer Inspection Probe for the shape of the finite element analysis to design and perform the test of life. Finite element analysis and the shape of the Wafer Inspection Probe relevance to the contact force and stress, and, when calculated using the stress and fatigue life prediction, compared with the test results verify the validity of that. This study suggested the consideration of fatigue life of the wafer probe in a systematic way to design a vertical probe card can be used effectively to improve the quality and performance is expected.