Moisture effects on adhesion of non‐conductive adhesive attachments

Purpose – Personal and portable electronic devices are becoming an important part of the everyday lives. Electronics miniaturization has been and continues to be the most important driver in this development. The current level of miniaturization has made the use of solder joints challenging and new methods, such as adhesive attachments, have been developed. The applicability of these methods depends crucially on their long‐term reliability. Typical failures mechanisms in adhesive connection include cracking, open joints and delamination. Moisture is the principal cause of failures in adhesive attachments. The purpose of this paper is to examine the long‐term effects of moisture and extended temperature on non‐conductive adhesive (NCA) attachments.Design/methodology/approach – Moisture and extended temperature on NCA attachments are examined by strength tests and by finite element models.Findings – The increase in temperature and moisture induces stresses on the interface of the adhesive and the chip. In t...