An integrated, wireless microinstrument for monitoring skin temperature
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This paper describes the initial design, construction and testing of an integrated, wireless, temperature microsensor designed to monitor skin temperature and transmit the information to a local receiver using a 350 MHz carrier frequency. The sensor chip measures 4.6 mm by 6.8 mm and is fully self-contained, incorporating the sensing circuitry as well as a microantenna on chip. The chip is fabricated in a 2.0 micron, twin-metal, twin-poly, N-well, BiCMOS process technology provided by the DARPA MOSIS fabrication service.
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