An integrated, wireless microinstrument for monitoring skin temperature

This paper describes the initial design, construction and testing of an integrated, wireless, temperature microsensor designed to monitor skin temperature and transmit the information to a local receiver using a 350 MHz carrier frequency. The sensor chip measures 4.6 mm by 6.8 mm and is fully self-contained, incorporating the sensing circuitry as well as a microantenna on chip. The chip is fabricated in a 2.0 micron, twin-metal, twin-poly, N-well, BiCMOS process technology provided by the DARPA MOSIS fabrication service.