Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors.

A 4-channel silicon photonics transceiver array for Point-to-Point (P2P) fiber-to-the-home (FTTH) optical networks at the central office (CO) side is demonstrated. A III-V O-band photodetector array was integrated onto the silicon photonic transmitter through transfer printing technology, showing a polarization-independent responsivity of 0.39 - 0.49 A/W in the O-band. The integrated PDs (30 × 40 μm2 mesa) have a 3 dB bandwidth of 11.5 GHz at -3 V bias. Together with high-speed C-band silicon ring modulators whose bandwidth is up to 15 GHz, operation of the transceiver array at 10 Gbit/s is demonstrated. The use of transfer printing for the integration of the III-V photodetectors allows for an efficient use of III-V material and enables the scalable integration of III-V devices on silicon photonics wafers, thereby reducing their cost.

[1]  S. Chandrasekhar,et al.  Monolithic Silicon Photonic Integrated Circuits for Compact 100 $^{+}$Gb/s Coherent Optical Receivers and Transmitters , 2014, IEEE Journal of Selected Topics in Quantum Electronics.

[2]  Matthew Meitl,et al.  Wafer-scale integration of group III–V lasers on silicon using transfer printing of epitaxial layers , 2012, Nature Photonics.

[3]  Paolo Cardile,et al.  Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters. , 2016, Optics express.

[4]  Brian Corbett,et al.  Transfer Printing of AlGaInAs/InP Etched Facet Lasers to Si Substrates , 2016, IEEE Photonics Journal.

[5]  Weidong Zhou,et al.  Transfer-printed stacked nanomembrane lasers on silicon , 2012, Nature Photonics.

[6]  J. Rogers,et al.  A printable form of silicon for high performance thin film transistors on plastic substrates , 2004 .

[7]  Hartmut Hillmer,et al.  Micromachining of InP/InGaAs multiple membrane/airgap structures for tunable optical devices , 2008, SPIE Photonics Europe.

[8]  G. Fish,et al.  Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers , 2015, IEEE Journal of Selected Topics in Quantum Electronics.

[9]  P. Verheyen,et al.  High-efficiency fiber-to-chip grating couplers realized using an advanced CMOS-compatible silicon-on-insulator platform. , 2010, Optics express.

[10]  S. Iwamoto,et al.  InAs/GaAs Quantum Dot Lasers on Silicon-on-Insulator Substrates by Metal-Stripe Wafer Bonding , 2015, IEEE Photonics Technology Letters.

[11]  van Pj René Veldhoven,et al.  Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate , 2013 .