An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model

Abstract The Engelmaier model is a strain-range-based fatigue model for evaluating the life expectancy of solder joints under power and temperature cycling. The model relates cycles to failure to a strain range metric using a power law relationship. In Engelmaier’s original formulation in 1983, the exponent term in the power law relationship was defined to be a function of mean cyclic temperature and cyclic frequency. Engelmaier replaced the cyclic frequency with dwell time in 1988 without explanation. This paper provides a rationale and the implications for changing the formulation of the exponent term of the Engelmaier model. Using non-linear regression, model constants are derived for Engelmaier model formulations with cyclic frequency and dwell time parameters. A t -statistic measure is estimated to quantify the influence of cyclic frequency and dwell time parameters on the cycles to failure. In tin-based lead-free solders, the absolute values of the t -statistic for cyclic frequency are approximately 3–10% higher than that for dwell time. The higher absolute value of a t -statistic identifies a stronger dependence of cycles to failure on cyclic frequency than on dwell time. Then, the feasibility of replacing the mean cyclic temperature parameter in the exponent term with time-averaged cyclic temperature using t -statistic measures is explored. Based on the evaluation of t -statistic measures, the authors recommend the Engelmaier model with cyclic frequency and mean cyclic temperature parameters to be used for solder joint life prediction.

[1]  C. L.,et al.  Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation , 2010 .

[2]  W. Engelmaier,et al.  Generic reliability figures of merit design tools for surface mount solder attachments , 1993 .

[3]  Peng Liu,et al.  Effect of Ramp Rate on Microstructure and Properties of Thermomechanically-Fatigued Sn-3.5Ag Based Composite Solder Joints , 2006, 2006 7th International Conference on Electronic Packaging Technology.

[4]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[5]  M. Osterman,et al.  Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability , 2009, IEEE Transactions on Components and Packaging Technologies.

[6]  Y. S. Chan,et al.  Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling , 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

[7]  D. Das,et al.  Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications , 2011, IEEE Transactions on Device and Materials Reliability.

[9]  L. Coffin,et al.  A Study of the Effects of Cyclic Thermal Stresses on a Ductile Metal , 1954, Journal of Fluids Engineering.

[10]  M. Osterman,et al.  A strain range based model for life assessment of Pb-free SAC solder interconnects , 2006, 56th Electronic Components and Technology Conference 2006.

[11]  W. Engelmaier,et al.  SOLDER JOINTS IN ELECTRONICS: DESIGN FOR RELIABILITY , 1999 .

[12]  Sidharth,et al.  Board level solder reliability versus ramp rate and dwell time during temperature cycling , 2003 .

[13]  W. Engelmaier Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling , 1983 .

[14]  Xuejun Fan,et al.  Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

[15]  S. Manson Behavior of materials under conditions of thermal stress , 1953 .