Reliability studies of Sn-Ag-Cu BGA solder joints on Ni/Cu/Au surface finish for SMAFTI packaging technology
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K. Soejima | M. Kawano | M. Kawano | Y. Kurita | K. Soejima | F. Kawashiro | F. Kawashiro | M. Ujiie | K. Shibuya | Y. Kurita | M. Ujiie | K. Shibuya
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