论文信息 - Wiring And Crosstalk Avoidance In Multi-chip Module Design

Wiring And Crosstalk Avoidance In Multi-chip Module Design

Wiring and Crosstalk Avoidance in Multi-Chip Module Design Howard H. Chen and C. K. Wong IBM Research Division Thomas J. Watson Research Center P.O. Box 218, Yorktown Heights, NY 10598 This paper presents a channel-based thin-film wiring methodology for multi-chip module design. Crosstalk between adjacent transmission lines are specifically calculated and minimized during routing to avoid excessive coupled noises being propagated from the driver to the receivers. On a benchmark TCM module with 124 chips, this special wiring technique completes 42,044 connections on two thin-film layers and satisfies all wire length restrictions and noise limits.

H. H. Chen | C. K. Wong

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