The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

The accurate prediction of the temperatures of critical electronic parts at the package, board and system level is seriously hampered by the lack of reliable, standardized input data that characterize the thermal behaviour of these parts. The recently completed collaborative European project DELPHI has been concerned with the creation and experimental validation of thermal models (both detailed and compact) of a range of electronic parts, including mono-chip packages, heat sinks, electrolytic capacitors, transformers, and interfacing materials. The ultimate goal of the DELPHI project was to get component manufacturers to supply validated thermal models of their parts to end users by adopting the experimental techniques used to validate the detailed thermal conduction models of the parts, and the methods to generate compact models. Part II of this paper contains technical information on both experimental and numerical methods. In order to reduce design-cycle time and physical prototyping, equipment manufacturers need to ascertain the thermal performance of new systems at the earliest possible stage of the design process. Accurate, validated thermal models of the critical parts used in the design are needed to provide the thermal precision necessary to design out the functional and reliability failures that result from component overheating.

[1]  Clemens J. M. Lasance,et al.  A transient method for the accurate measurement of interface thermal resistances , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[2]  Harvey I Rosten,et al.  DELPHI: The Development of Libraries of Physical Models of Electronic Components for an Integrated Design Environment , 1995 .

[3]  J.D. Parry,et al.  Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[4]  A. Bar-Cohen,et al.  Theta /sub JC/ characterization of chip packages-justification, limitations, and future , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[5]  M. Mahalingam,et al.  Surface mount plastic packages-an assessment of their thermal performance , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[6]  H. Vinke,et al.  Thermal characterization of electronic devices with boundary condition independent compact models , 1995 .

[7]  Clemens J. M. Lasance.  Thermal characterization of electronic parts with compact models: interpretation, application, and the need for a paradigm shift , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[8]  H. Vinke,et al.  Recent achievements in the thermal characterization of electronic devices by means of boundary condition independent compact models , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[9]  G. B. Kromann,et al.  The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[10]  H. I. Rosten.  Delphi — A Status Report on the Esprit Funded Project for the Creation and Validation of Thermal Models of Electronic Parts , 1997 .

[11]  E. Beyne,et al.  Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment , 1997 .

[12]  J. Andrews,et al.  Thermal Characteristics of 16- and 40-Pin Plastic DIP's , 1981 .

[13]  V.H. Adams,et al.  Issues in validating package compact thermal models for natural convection cooled electronic systems , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[14]  W. Temmerman,et al.  Experimental Validation Methods for Thermal Models , 1997 .

[15]  Kenneth Rodgers,et al.  Thermal resistance measurement protocols , 1998 .

[16]  H. Vinke,et al.  Thermal Characterization of Electronic Devices by Means of Improved Boundary Condition Independent Compact Models , 1997 .

[17]  H. Vinke,et al.  A novel approach for the thermal characterization of electronic parts , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[18]  J. P. le Jannou,et al.  Representation of thermal behavior of electronic components for the creation of a databank , 1991 .

[19]  H. Vinke,et al.  Compact models for accurate thermal characterization of electronic parts , 1997 .

[20]  C. Lasance,et al.  NATURAL CONVECTION EXPERIMENTS WITH CUBOIDS AND CYLINDERS OF EQUAL AREA , 1997 .

[21]  H. I. Rosten,et al.  Thermal modelling of the Pentium processor package , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[22]  H. I. Rosten.  DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.