Transmission/Reflection Measurement and Near-Field Mapping Techniques for Passive Intermodulation Characterisation of Printed Lines

Printed circuit boards (PCB) represent one of the major technological bases for manufacturing packaged components, devices and systems. In many high frequency applications, low level of passive intermodulation (PIM) produced by PCB materials is an essential requirement. However, the nature of PIM generation in PCB laminates is not fully understood, and the experimental evaluation of PIM products in printed circuits still needs further elaboration.

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