Solvent-assisted delamination of layered copper dithienothiophene-dicarboxylate (DUT-134)
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S. Kaskel | I. Senkovska | D. Pohl | B. Rellinghaus | V. Bon | Stefanie Lochmann | F. Schwotzer | J. Evans
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S. Kaskel | I. Senkovska | D. Pohl | B. Rellinghaus | V. Bon | Stefanie Lochmann | F. Schwotzer | J. Evans