Microleakage of four simplified adhesive systems under thermal and mechanical stresses.

PURPOSE To evaluate microleakage at the dentin margins of Class II resin-based composite restorations using four simplified adhesive systems: Etch & Prime 3.0, Prime & Bond NT, Clearfil Liner Bond 2V and Clearfil SE Bond, upon thermal and mechanical stresses. MATERIALS AND METHODS Forty slot preparations (5mm x 3mm x 1.5mm) were cut in sound human molars with gingival margins below the cement/enamel junction. All adhesive systems were applied strictly according to manufacturers' instructions. Cavities were restored using Clearfil AP-X composite resin. After finishing and polishing, teeth were submitted to thermal (x700, 5-55 degrees C, 60-second dwell time) and consecutively mechanical cycling (100,000 cycle; 8 Kgf load). Specimens were coated with nail polish, immersed in silver nitrate for 2 hours and sectioned longitudinally with a diamond disc. The extent of leakage was ranked using a 0-4 scale. RESULTS Statistical analysis was performed using Kruskal-Wallis test. Minimal leakage occurred with Clearfil SE Bond. There was a statistically significant difference (P<0.01) between this system and Clearfil Liner Bond 2V, although the latter also showed low values of dye penetration. No statistically significant difference was found between Etch & Prime 3.0 and Prime & Bond NT. Both showed statistically greater leakage than the two other systems (P<0.01).