Electrical, thermal and mechanical properties of poly-etherimide epoxy-diamine blend

This work deals with the study of thermoset-thermoplastic blend forming an epoxy-amine/poly-etherimide phase separated to assess the dielectric and thermal performances. These materials would be good candidates to replace the passivation layer in semiconductors, particularly ones used as switches in power electronic applications. Polyimide and Parylene are usually quoted and studied. Mixtures based on polymers would be a novel candidate that can manage to be an insulator for the system. The modified and non-modified systems where characterized by transmission electron microscopy, scanning electron microscopy, differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, dielectric analysis and analytical simulation was carried out on dielectric measurements. These complementary techniques were used first to investigate the presence of the phase separation phenomenon and second to quantify the separated nodules size. The effect of this phase separation was examined and showed enhancement in the dielectric values compared to the pure epoxy system. It was finally simulated to show a close assumption of what is found experimentally.

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