论文信息 - Investigation of the microstructure and toughness of 550 MPa grade pipeline after the hot-bending process - 字舞流文

Investigation of the microstructure and toughness of 550 MPa grade pipeline after the hot-bending process

Y. Tsai | C. Shang | X. M. Wang | W. Yang | X. Wang | J. R. Yang | Xuemin Wang | X. L. Wang | L. M. Dong | W. Yang | W. Yang