Optimized pad design for millimeter-wave applications with a 65nm CMOS RF technology
暂无分享,去创建一个
[1] B. Floyd,et al. A 60GHz radio chipset fully-integrated in a low-cost packaging technology , 2006, 56th Electronic Components and Technology Conference 2006.
[2] R.W. Brodersen,et al. Design of CMOS for 60GHz applications , 2004, 2004 IEEE International Solid-State Circuits Conference (IEEE Cat. No.04CH37519).
[3] U.R. Pfeiffer. Low-loss contact pad with tuned impedance for operation at millimeter wave frequencies , 2005, Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005..
[4] Markus Paul Josef Mergens. On-chip ESD protection in integrated circuits , 2001 .
[5] F. Gianesello,et al. 65 nm RFCMOS technologies with bulk and HR SOI substrate for millimeter wave passives and circuits characterized up to 220 GHZ , 2006, 2006 IEEE MTT-S International Microwave Symposium Digest.