FEDRAM: A capacitor-less DRAM based on ferroelectric-gated field-effect transistor
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A capacitor-less DRAM cell based on ferroelectric-gate memory transistor structure, FErroelectric-DRAM (FEDRAM), is introduced. Compared to the conventional DRAM cell, it offers much simpler cell structure, longer retention time, better scalability, and lower power consumption. Cell size of 4F2 can be realized. It is also most suitable for embedded applications. Recent developments of the HfO2-based ferroelectrics have overcome the shortcomings of PZT and SBT for FEDRAM technology, and make the commercialization of FEDRAM much closer to reality.
[1] Tso-Ping Ma,et al. Ferroelectric DRAM (FEDRAM) FET with metal/SrBi/sub 2/Ta/sub 2/O/sub 9//SiN/Si gate structure , 2002 .
[2] Tengyu Ma,et al. Why is nonvolatile ferroelectric memory field-effect transistor still elusive? , 2002, IEEE Electron Device Letters.
[3] S. Lee,et al. High-performance InP/In/sub 0.53/Ga/sub 0.47/As/InP double HBTs on GaAs substrates , 2002, IEEE Electron Device Letters.