Review of wide band-gap semiconductors technology

Silicon carbide (SiC) and gallium nitride (GaN) are typical representative of the wide band-gap semiconductor material, which is also known as third-generation semiconductor materials. Compared with the conventional semiconductor silicon (Si) or gallium arsenide (GaAs), wide band-gap semiconductor has the wide band gap, high saturated drift velocity, high critical breakdown field and other advantages; it is a highly desirable semiconductor material applied under the case of high-power, high-temperature, high-frequency, anti-radiation environment. These advantages of wide band-gap devices make them a hot spot of semiconductor technology research in various countries. This article describes the research agenda of United States and European in this area, focusing on the recent developments of the wide band-gap technology in the US and Europe, summed up the facing challenge of the wide band-gap technology.

[1]  Daisuke Ueda,et al.  Recent advances in GaN transistors for future emerging applications , 2009 .

[2]  D. Schmelzer,et al.  A GaN HEMT Class F Amplifier at 2 GHz With $>\,$80% PAE , 2006, IEEE Journal of Solid-State Circuits.

[3]  H. Ishida,et al.  Gate Injection Transistor (GIT)—A Normally-Off AlGaN/GaN Power Transistor Using Conductivity Modulation , 2007, IEEE Transactions on Electron Devices.

[4]  Wei Huang,et al.  High-performance AlGaN∕GaN lateral field-effect rectifiers compatible with high electron mobility transistors , 2008 .

[5]  Mark J. Rosker,et al.  DARPA's GaN technology thrust , 2010, 2010 IEEE MTT-S International Microwave Symposium.

[6]  M.J. Rosker Technologies for Next Generation T/R Modules , 2007, 2007 IEEE Radar Conference.

[7]  King-Yuen Wong,et al.  Single-Chip Boost Converter Using Monolithically Integrated AlGaN/GaN Lateral Field-Effect Rectifier and Normally Off HEMT , 2009, IEEE Electron Device Letters.

[8]  T. Chow,et al.  High-voltage SiC and GaN power devices , 2004, Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting.

[9]  Jean-Michel Nebus,et al.  Experimental study on effect of second-harmonic injection at input of classes F and F -1 GaN power amplifiers , 2010 .

[10]  F. Giannazzo,et al.  Challenges for energy efficient wide band gap semiconductor power devices , 2014 .

[11]  Mark J. Rosker,et al.  The DARPA Wide Band Gap Semiconductors for RF Applications (WBGS-RF) Program: Phase II Results , 2009 .

[12]  D. Klimm Electronic materials with a wide band gap: recent developments , 2014, IUCrJ.

[13]  Kevin J. Chen,et al.  Integrated voltage reference and comparator circuits for GaN smart power chip technology , 2009, 2009 21st International Symposium on Power Semiconductor Devices & IC's.

[14]  K. Arai,et al.  700-V 1.0-$hboxmOmega cdot hboxcm^2$Buried Gate SiC-SIT (SiC-BGSIT) , 2006, IEEE Electron Device Letters.

[15]  Sei-Hyung Ryu,et al.  Recent Advances in High-Voltage, High-Frequency Silicon-Carbide Power Devices , 2006, Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting.

[16]  A. Hefner Status of High-Voltage, High-Frequency Silicon-Carbide Power Devices | NIST , 2006 .

[17]  Li Zhao-ji Recent Development and Future Perspective of Silicon Carbide Power Devices——Opportunity and Challenge , 2009 .

[18]  S. Yoshida,et al.  Enhancement-mode gan hybrid mos-hemts with ron,sp of 20 mω-cm2 , 2008, 2008 20th International Symposium on Power Semiconductor Devices and IC's.