Thermal and insulating properties of epoxy/aluminum nitride composites used for thermal interface material

We synthesized an epoxy matrix composite adhesive containing aluminum nitride (AlN) powder, which was used for thermal interface materials (TIM) in high power devices. The experimental results revealed that adding AlN fillers into epoxy resin was an effective way to boost thermal conductivity and maintain electrical insulation. We also discovered a proper coupling agent that reduced the viscosity of the epoxy-AlN composite by AlN surface treatment and increased the solid loading to 60 vol %. For the TIM sample made with the composite adhesive, we obtained a thermal conductivity of 2.70 W/(m K), which was approximately 13 times larger than that of pure epoxy. The dielectric strength of the TIM was 10 to 11 kV/mm, which was large enough for applications in high power devices. Additionally, the thermal and insulating properties of the TIM did not degrade after thermal shock testing, indicating its reliability for use in power devices. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012

[1]  Liangliang Li,et al.  Dielectric composite material with enhanced thermal conductivity used for electronic packaging , 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

[2]  Xingyi Huang,et al.  Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites: Effects of nanoparticle surface modification , 2010 .

[3]  R. Fu,et al.  High Thermal Conductive Epoxy Molding Compound with Thermal Conductive Pathway , 2009 .

[4]  C. Zhi,et al.  Towards Thermoconductive, Electrically Insulating Polymeric Composites with Boron Nitride Nanotubes as Fillers , 2009 .

[5]  K. Watari,et al.  High‐Thermal‐Conductivity AlN Filler for Polymer/Ceramics Composites , 2009 .

[6]  Eunsung Lee,et al.  Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin , 2008 .

[7]  David P. Anderson,et al.  Improved thermal conductivity for chemically functionalized exfoliated graphite/epoxy composites , 2008 .

[8]  D. Shanefield,et al.  Improved dispersion of aluminum nitride particles in epoxy resin by adsorption of two-layer surfactants , 2008 .

[9]  Carl Zweben,et al.  Advances in photonics thermal management and packaging materials , 2008, SPIE OPTO.

[10]  H. Liem,et al.  Enhanced thermal conductivity of boron nitride epoxy‐matrix composite through multi‐modal particle size mixing , 2007 .

[11]  Jason M. Keith,et al.  Thermal conductivity models for carbon/liquid crystal polymer composites , 2007 .

[12]  K. Lafdi,et al.  Use of exfoliated graphite filler to enhance polymer physical properties , 2007 .

[13]  C. Xie,et al.  Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate , 2007 .

[14]  Shuhua Qi,et al.  Effect of the particle size of Al2O3 on the properties of filled heat‐conductive silicone rubber , 2007 .

[15]  M. Dresselhaus,et al.  Enhanced thermal conductivity of carbon fiber/phenolic resin composites by the introduction of carbon nanotubes , 2007 .

[16]  I. Tavman,et al.  Effect of Particle Shape on Thermal Conductivity of Copper Reinforced Polymer Composites , 2007 .

[17]  C. Hsieh,et al.  High thermal conductivity epoxy molding compound filled with a combustion synthesized AlN powder , 2006 .

[18]  Ravi Prasher,et al.  Thermal Interface Materials: Historical Perspective, Status, and Future Directions , 2006, Proceedings of the IEEE.

[19]  Jae Ik Lee,et al.  Enhanced thermal conductivity of polymer composites filled with hybrid filler , 2006 .

[20]  P. Supancic,et al.  Thermal Conductivity of Platelet‐Filled Polymer Composites , 2004 .

[21]  Jiajun Wang,et al.  Preparation and the properties of PMR‐type polyimide composites with aluminum nitride , 2003 .

[22]  Junko Morikawa,et al.  New Technique for Fourier Transform Thermal Analysis , 2001 .

[23]  D.D.L. Chung,et al.  Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments , 2000 .

[24]  Ching-Ping Wong,et al.  Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging , 1999 .

[25]  D. Chung,et al.  Thermally conducting polymer-matrix composites containing both AIN particles and SiC whiskers , 1994 .