Rigorous wafer topography simulation for investigating wafer alignment quality and robustness
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Detlef Hofmann | Nicolo Morgana | Andreas Greiner | Holger Moeller | Ulrich Klostermann | Juergen Preuninger | Dmitrii Gavrilin | Itaru Kamohara
[1] Jae-Sung Choi,et al. Optimization of alignment strategy for metal layer on local interconnect integration , 2009, Advanced Lithography.
[2] Qi-De Qian,et al. Laser alignment modeling using rigorous numerical simulations , 1991, Other Conferences.
[4] Andreas Erdmann,et al. Rigorous simulation of alignment for microlithography , 2003 .
[5] Han-Ku Cho,et al. Overlay metrology for dark hard mask process: simulation and experiment study , 2007, SPIE Advanced Lithography.
[6] S. Wolf,et al. Silicon Processing for the VLSI Era , 1986 .
[7] Hyun-Jo Yang,et al. Effects of alignment accuracy on CMP process for overlay control , 2000, Advanced Lithography.
[8] Qiang Wu,et al. Optimization of segmented alignment marks for advanced semiconductor fabrication processes , 2001, SPIE Advanced Lithography.
[9] Qiang Wu,et al. Ultrafast wafer alignment simulation based on thin film theory , 2002, SPIE Advanced Lithography.
[10] Cheol-Hong Kim,et al. A comparison of alignment and overlay performance with varying hardmask materials , 2012, Advanced Lithography.
[11] Richard van Haren,et al. New color alignment for CMOS image sensor , 2007, SPIE Advanced Lithography.
[12] Hiroshi Tanaka,et al. A study of overlay mark robustness and enhanced alignment techniques for alignment improvement on metal layers of sub-100nm technology , 2007, SPIE Advanced Lithography.
[13] Han-Ku Cho,et al. Optimization of geometry of alignment mark using rigorous coupled-wave analysis (RCWA) , 2005, SPIE Advanced Lithography.
[14] Richard van Haren,et al. Segmented alignment mark optimization and signal strength enhancement for deep trench process , 2004, SPIE Advanced Lithography.