Design of High-Frequency Ultrasonic Transducers With Flexure Decoupling Flanges for Thermosonic Bonding

This paper presents the design of high-frequency ultrasonic transducers for micro/nano device thermosonic bonding. The transducers are actuated by piezoelectric ceramics and decoupled with their connecting parts through novel flexure decoupling flanges. First, the initial geometric dimensions of the transducers were calculated using electromechanical equivalent method, then dynamic optimization design was carried out based on three-dimensional (3-D) finite element method (FEM), and the geometric dimensions of the transducer were finally determined. Flexure decoupling flanges were presented, and the decoupling principle of the flanges was explained through compliance modeling using compliance matrix method and FEM. After that the dynamic characteristics of the transducers were analyzed through finite element analysis (FEA). The vibration frequencies and modes of the piezoelectric converter, concentrators, and transducers were obtained through modal analysis, and the displacement nodes were determined. The longitudinal ultrasonic energy transmission was presented, and the decoupling effects of the flexure flanges were compared. Finally, the transducers were manufactured and experimental tests were conducted to examine the transducer characteristics using an impedance analyzer. The experimental results match well with the FEA. The results show that the longitudinal vibration frequencies of the transducers with ring, prismatic beam, and circular notched hinge-based flanges are 126.6, 125.8, and 125.52 kHz, respectively. The decoupling flange with circular notched hinges shows the best decoupling effect among the three types of flanges.

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