Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials
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[1] C. Soles,et al. A discussion of the molecular mechanisms of moisture transport in epoxy resins , 2000 .
[2] C. Soles,et al. Contributions of the nanovoid structure to the kinetics of moisture transport in epoxy resins , 2000 .
[3] John Crank,et al. The Mathematics Of Diffusion , 1956 .
[4] G. Springer,et al. Moisture Absorption and Desorption of Composite Materials , 1976 .
[5] Ching-Ping Wong,et al. High performance no flow underfills for low-cost flip-chip applications , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.
[6] Jianmin Qu,et al. Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface , 2000, Packaging of Electronic and Photonic Devices.
[7] John W. Gillespie,et al. Moisture diffusion in epoxy systems , 1999 .