论文信息 - Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient - 字舞流文

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

N. Zhao | Y. Zhong | M. Huang | H.T. Ma | W. Dong | H.T. Ma | M.L. Huang | H.T. Ma