论文信息 - A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect - 字舞流文

A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect

T. Kurihara | M. Sunohara | M. Higashi | Y. Yoneda | H. Izumino | K. Kumagai | H. Shimojo | Y. Mabuchi