A new edge structure for 2 KVolt power IC operation

A new edge structure for 2 KVolt Power IC operation is introduced which features low concentration rings defined on two epilayers to increase the final junction depth. Computer simulations performed to assess the structure viability have been followed by experiments varying the implant dose. Breakdown voltages up to 2000 and 1200 Volts have been measured on UHV and VHV wafers for a wide range of implanted doses demonstrating good process latitude. Production devices featuring the new structure have been fabricated, preliminary results on an off-line SMPS are presented.

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