Fabrication and Performance of MEMS-Based Pressure Sensor Packages Using Patterned Ultra-Thick Photoresists
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[1] H. S. Wolff,et al. iRun: Horizontal and Vertical Shape of a Region-Based Graph Compression , 2022, Sensors.
[2] S.C.O. Mathuna,et al. Thick photoresist development for the fabrication of high aspect ratio magnetic coils , 2002 .
[3] C. Hsu,et al. The Effect of Epoxy Molding Compound on Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing Process , 2006, IEEE Transactions on Components and Packaging Technologies.
[4] Peter Vettiger,et al. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS , 1998 .
[5] Chang-Chun Lee,et al. Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies , 2006 .
[6] J. Logan,et al. Two-chip pressure sensor and signal conditioning , 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).
[7] Narasimalu Srikanth,et al. Development of transfer molding technology for package with die active side partially exposed , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[8] E. Abbaspour-Sani,et al. A novel method for packaging of micromachined piezoresistive pressure sensor , 2002, ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575).
[9] Charles S. Smith. Piezoresistance Effect in Germanium and Silicon , 1954 .
[10] Andre Bossche,et al. Low-cost plastic sensor packaging using the open-window package concept , 1998 .
[11] N. D. Rooij,et al. High aspect ratio UV photolithography for electroplated structures , 1999 .
[12] Zhuangde Jiang,et al. Analysis of the Packaging Stresses in Monolithic Multi-Sensor , 2007, 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
[13] Per Ohlckers,et al. Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors , 1998 .
[14] Y. Kim,et al. Packaging Effect on MEMS Pressure Sensor Performance , 2007, IEEE Transactions on Components and Packaging Technologies.
[15] John Wertz,et al. Analytical techniques for examining reliability and failure mechanisms of barrier-coated encapsulated silicon pressure sensors exposed to harsh media , 1996, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[16] Yeong K. Kim,et al. Finite element simulation of package stress in transfer molded MEMS pressure sensors , 2004, Microelectron. Reliab..
[17] T. Janczek. Material investigation for pressure sensor package P-DSOF-8-1 , 1997, Proceedings. The First IEEE International Symposium on Polymeric Electronics Packaging, PEP '97 (Cat. No.97TH8268).
[18] Chung-Yi Hsu,et al. A novel packaging process for open-channel sensors , 2007, 2007 International Microsystems, Packaging, Assembly and Circuits Technology.
[19] P. Vettiger,et al. Fabrication of photoplastic high-aspect ratio microparts and micromolds using SU-8 UV resist , 1998 .
[20] Chung-Yi Hsu,et al. A tiny plastic package of piezoresistive pressure sensors constructed by sacrifice-replacement approach , 2008, 2008 58th Electronic Components and Technology Conference.
[21] Michael Kraft,et al. Realization of electroplating molds with thick positive SPR 220-7 photoresist , 2003 .
[22] Chun-Te Lin,et al. Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology , 2005 .
[23] Fan-Gang Tseng,et al. High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist , 2002 .
[24] Jane M. Shaw,et al. Micromachining applications of a high resolution ultrathick photoresist , 1995 .
[25] W. Cheng,et al. A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach , 2009 .
[26] M. Despont,et al. SU-8: a low-cost negative resist for MEMS , 1997 .